Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials

Nowadays, a range of sensors and actuators can be realized directly in the structure of textile substrates using metal-plated yarns, metal-filament yarns, or functionalized yarns with nanomaterials, such as nanowires, nanoparticles, or carbon materials. However, the evaluation or control circuits st...

Descripción completa

Detalles Bibliográficos
Autores principales: Kalaš, David, Soukup, Radek, Řeboun, Jan, Radouchová, Michaela, Rous, Pavel, Hamáček, Aleš
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10255827/
https://www.ncbi.nlm.nih.gov/pubmed/37299324
http://dx.doi.org/10.3390/polym15112526

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10255827/
https://www.ncbi.nlm.nih.gov/pubmed/37299324
http://dx.doi.org/10.3390/polym15112526

Ejemplares similares