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An end-to-end convolutional neural network for automated failure localisation and characterisation of 3D interconnects
The advancement in the field of 3D integration circuit technology leads to new challenges for quality assessment of interconnects such as through silicon vias (TSVs) in terms of automated and time-efficient analysis. In this paper, we develop a fully automated high-efficient End-to-End Convolutional...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10256798/ https://www.ncbi.nlm.nih.gov/pubmed/37296180 http://dx.doi.org/10.1038/s41598-023-35048-0 |