Three-Dimensional Integrated Fan-Out Wafer-Level Package Micro-Bump Electromigration Study

To meet the demands for miniaturization and multi-functional and high-performance electronics applications, the semiconductor industry has shifted its packaging approach to multi-chip vertical stacking. Among the advanced packaging technologies for high-density interconnects, the most persistent fac...

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Detalles Bibliográficos
Autores principales: Tian, Wenchao, Gao, Ran, Gu, Lin, Ji, Haoyue, Zhou, Liming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301314/
https://www.ncbi.nlm.nih.gov/pubmed/37374840
http://dx.doi.org/10.3390/mi14061255

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301314/
https://www.ncbi.nlm.nih.gov/pubmed/37374840
http://dx.doi.org/10.3390/mi14061255

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