Cargando…
Three-Dimensional Integrated Fan-Out Wafer-Level Package Micro-Bump Electromigration Study
To meet the demands for miniaturization and multi-functional and high-performance electronics applications, the semiconductor industry has shifted its packaging approach to multi-chip vertical stacking. Among the advanced packaging technologies for high-density interconnects, the most persistent fac...
| Autores principales: | , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301314/ https://www.ncbi.nlm.nih.gov/pubmed/37374840 http://dx.doi.org/10.3390/mi14061255 |