A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images

Integrated circuit (IC) X-ray wire bonding image inspections are crucial for ensuring the quality of packaged products. However, detecting defects in IC chips can be challenging due to the slow defect detection speed and the high energy consumption of the available models. In this paper, we propose...

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Detalles Bibliográficos
Autores principales: Zhan, Daohua, Lin, Jian, Yang, Xiuding, Huang, Renbin, Yi, Kunran, Liu, Maoling, Zheng, Hehui, Xiong, Jingang, Cai, Nian, Wang, Han, Qiu, Baojun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301426/
https://www.ncbi.nlm.nih.gov/pubmed/37374704
http://dx.doi.org/10.3390/mi14061119

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301426/
https://www.ncbi.nlm.nih.gov/pubmed/37374704
http://dx.doi.org/10.3390/mi14061119

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