Fabrication and Characterization of Thin Metal Films Deposited by Electroless Plating with Organic Additives for Electrical Circuits Applications

In our work, we studied thin nickel films deposited by electroless plating for use as a barrier and seed layer in the through-silicon vias (TSV) technology. El-Ni coatings were deposited on a copper substrate from the original electrolyte and with the use of various concentrations of organic additiv...

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Detalles Bibliográficos
Autores principales: Buylov, Nikita S., Sotskaya, Nadezhda V., Kozaderov, Oleg A., Shikhaliev, Khidmet S., Potapov, Andrey Yu., Polikarchuk, Vladimir A., Rodivilov, Sergey V., Pobedinskiy, Vitaly V., Grechkina, Margaryta V., Seredin, Pavel V.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301428/
https://www.ncbi.nlm.nih.gov/pubmed/37374736
http://dx.doi.org/10.3390/mi14061151

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301428/
https://www.ncbi.nlm.nih.gov/pubmed/37374736
http://dx.doi.org/10.3390/mi14061151

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