Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis

The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated. Real-time synchrotron imaging was used to investig...

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Detalles Bibliográficos
Autores principales: Amli, Siti Farahnabilah Muhd, Salleh, Mohd Arif Anuar Mohd, Aziz, Mohd Sharizal Abdul, Yasuda, Hideyuki, Nogita, Kazuhiro, Abdullah, Mohd Mustafa Al Bakri, Nemes, Ovidiu, Sandu, Andrei Victor, Vizureanu, Petrica
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10302092/
https://www.ncbi.nlm.nih.gov/pubmed/37374543
http://dx.doi.org/10.3390/ma16124360

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10302092/
https://www.ncbi.nlm.nih.gov/pubmed/37374543
http://dx.doi.org/10.3390/ma16124360

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