A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading

Ag paste has been recognized as a promising substitute for Sn/Pb solder in SiC or GaN power electronic devices, owing to its ability to withstand high temperatures and facilitate low-temperature packing. The reliability of these high-power circuits is greatly influenced by the mechanical properties...

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Detalles Bibliográficos
Autores principales: Ma, Kun, Liu, Xun, Sun, Yameng, Song, Yifan, Feng, Zheng, Zhou, Yang, Liu, Sheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10303147/
https://www.ncbi.nlm.nih.gov/pubmed/37374655
http://dx.doi.org/10.3390/ma16124472

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10303147/
https://www.ncbi.nlm.nih.gov/pubmed/37374655
http://dx.doi.org/10.3390/ma16124472

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