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A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading
Ag paste has been recognized as a promising substitute for Sn/Pb solder in SiC or GaN power electronic devices, owing to its ability to withstand high temperatures and facilitate low-temperature packing. The reliability of these high-power circuits is greatly influenced by the mechanical properties...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10303147/ https://www.ncbi.nlm.nih.gov/pubmed/37374655 http://dx.doi.org/10.3390/ma16124472 |