Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP

Gallium nitride (GaN) power devices have many benefits, including high power density, small footprint, high operating voltage, and excellent power gain capability. However, in contrast to silicon carbide (SiC), its performance and reliability can be negatively impacted by its low thermal conductivit...

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Detalles Bibliográficos
Autores principales: Yan, Lei, Liu, Peisheng, Xu, Pengpeng, Tan, Lipeng, Zhang, Zhao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10303685/
https://www.ncbi.nlm.nih.gov/pubmed/37374830
http://dx.doi.org/10.3390/mi14061245

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10303685/
https://www.ncbi.nlm.nih.gov/pubmed/37374830
http://dx.doi.org/10.3390/mi14061245

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