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Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP
Gallium nitride (GaN) power devices have many benefits, including high power density, small footprint, high operating voltage, and excellent power gain capability. However, in contrast to silicon carbide (SiC), its performance and reliability can be negatively impacted by its low thermal conductivit...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10303685/ https://www.ncbi.nlm.nih.gov/pubmed/37374830 http://dx.doi.org/10.3390/mi14061245 |