Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology

Three-dimensional (3D) integration based on through-silicon-via (TSV) technology provides a solution to the miniaturization of electronic systems. In this paper, novel integrated passive devices (IPDs) including capacitor, inductor, and bandpass filter are designed by employing TSV structures. For l...

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Detalles Bibliográficos
Autores principales: Dong, Hai, Ding, Yingtao, Wang, Han, Pan, Xingling, Zhou, Mingrui, Zhang, Ziyue
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10304437/
https://www.ncbi.nlm.nih.gov/pubmed/37374837
http://dx.doi.org/10.3390/mi14061251

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10304437/
https://www.ncbi.nlm.nih.gov/pubmed/37374837
http://dx.doi.org/10.3390/mi14061251

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