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Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology
Three-dimensional (3D) integration based on through-silicon-via (TSV) technology provides a solution to the miniaturization of electronic systems. In this paper, novel integrated passive devices (IPDs) including capacitor, inductor, and bandpass filter are designed by employing TSV structures. For l...
Autores principales: | , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10304437/ https://www.ncbi.nlm.nih.gov/pubmed/37374837 http://dx.doi.org/10.3390/mi14061251 |