Cargando…
Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology
Three-dimensional (3D) integration based on through-silicon-via (TSV) technology provides a solution to the miniaturization of electronic systems. In this paper, novel integrated passive devices (IPDs) including capacitor, inductor, and bandpass filter are designed by employing TSV structures. For l...
Autores principales: | Dong, Hai, Ding, Yingtao, Wang, Han, Pan, Xingling, Zhou, Mingrui, Zhang, Ziyue |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10304437/ https://www.ncbi.nlm.nih.gov/pubmed/37374837 http://dx.doi.org/10.3390/mi14061251 |
Ejemplares similares
-
Application of Compact Folded-Arms Square Open-Loop Resonator to Bandpass Filter Design
por: Nwajana, Augustine O., et al.
Publicado: (2023) -
Microwave bandpass filters for wideband communications
por: Zhu, Lei, et al.
Publicado: (2012) -
Design of a Switchable Filter for Reflectionless-Bandpass-to-Reflectionless-Bandstop Responses
por: Wu, Gangxiong, et al.
Publicado: (2023) -
Compact 5G Nonuniform Transmission Line Interdigital Bandpass Filter for 5G/UWB Reconfigurable Antenna
por: Saleh, Sahar, et al.
Publicado: (2022) -
Compact Wideband Groove Gap Waveguide Bandpass Filters Manufactured with 3D Printing and CNC Milling Techniques
por: Máximo-Gutierrez, Clara, et al.
Publicado: (2023)