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Modeling and Validation of Total Ionizing Dose Effect on the TSVs in RF Microsystem
Radio frequency (RF) systems utilizing through-silicon vias (TSVs) have been widely used in the aerospace and nuclear industry, which means that studying the total ionizing dose (TID) effect on TSV structures has become necessary. To investigate the TID effect on TSV structures, a 1D TSV capacitance...
Autores principales: | Yang, Lihong, Li, Zhumeng, Shan, Guangbao, Lu, Qijun, Fu, Yu |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10305358/ https://www.ncbi.nlm.nih.gov/pubmed/37374765 http://dx.doi.org/10.3390/mi14061180 |
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