Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging

Copper is the most common interconnecting material in the field of microelectronic packaging, which is widely used in advanced electronic packaging technologies. However, with the trend of the miniaturization of electronic devices, the dimensions of interconnectors have decreased from hundreds of mi...

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Detalles Bibliográficos
Autores principales: Chen, Ke-Xin, Gao, Li-Yin, Li, Zhe, Sun, Rong, Liu, Zhi-Quan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10342519/
https://www.ncbi.nlm.nih.gov/pubmed/37444927
http://dx.doi.org/10.3390/ma16134614

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10342519/
https://www.ncbi.nlm.nih.gov/pubmed/37444927
http://dx.doi.org/10.3390/ma16134614

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