Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages

Delamination is a critical failure mode in power electronics packages that can significantly impact their reliability and performance, due to the large amounts of electrical power managed by the most recent devices which induce remarkable thermomechanical loads. The finite element (FE) simulation of...

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Detalles Bibliográficos
Autores principales: Mirone, Giuseppe, Barbagallo, Raffaele, Bua, Giuseppe, La Rosa, Guido
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10343726/
https://www.ncbi.nlm.nih.gov/pubmed/37445122
http://dx.doi.org/10.3390/ma16134808

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10343726/
https://www.ncbi.nlm.nih.gov/pubmed/37445122
http://dx.doi.org/10.3390/ma16134808

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