Topology optimization for near-junction thermal spreading of electronics in ballistic-diffusive regime

Hotspots in electronic devices can cause overheating and reduce performance. Enhancing the thermal spreading ability is critical for reducing device temperature to improve the reliability. However, as devices shrink, phonon ballistic effects can increase thermal resistance, making conventional optim...

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Detalles Bibliográficos
Autores principales: Tang, Zheng-Lai, Shen, Yang, Li, Han-Ling, Cao, Bing-Yang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10359927/
https://www.ncbi.nlm.nih.gov/pubmed/37485369
http://dx.doi.org/10.1016/j.isci.2023.107179

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10359927/
https://www.ncbi.nlm.nih.gov/pubmed/37485369
http://dx.doi.org/10.1016/j.isci.2023.107179

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