Cargando…
Topology optimization for near-junction thermal spreading of electronics in ballistic-diffusive regime
Hotspots in electronic devices can cause overheating and reduce performance. Enhancing the thermal spreading ability is critical for reducing device temperature to improve the reliability. However, as devices shrink, phonon ballistic effects can increase thermal resistance, making conventional optim...
| Autores principales: | , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Elsevier
2023
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10359927/ https://www.ncbi.nlm.nih.gov/pubmed/37485369 http://dx.doi.org/10.1016/j.isci.2023.107179 |