Impact of Bonding Temperature on Microstructure, Mechanical, and Fracture Behaviors of TLP Bonded Joints of Al2219 with a Cu Interlayer

[Image: see text] The present study aims at producing transient liquid phase (TLP) bonded Al2219 joints with pure Cu (copper) as an interlayer. The TLP bonding is carried out at the bonding temperatures in the range of 480 to 520 °C while keeping the bonding pressure (2 MPa) and time (30 min.) const...

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Detalles Bibliográficos
Autores principales: Vatnalmath, Manjunath, Auradi, Virupaxi, J, Varun Kumar M, Murthy, Bharath Vedashantha, Nagaral, Madeva, Pandian, A. Anbarasa, Islam, Saiful, Khan, Mohammad Shahiq, Anjinappa, Chandrashekar, Razak, Abdul
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2023
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10373175/
https://www.ncbi.nlm.nih.gov/pubmed/37521657
http://dx.doi.org/10.1021/acsomega.3c02838

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10373175/
https://www.ncbi.nlm.nih.gov/pubmed/37521657
http://dx.doi.org/10.1021/acsomega.3c02838

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