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On Relationships between Plasma Chemistry and Surface Reaction Kinetics Providing the Etching of Silicon in CF(4), CHF(3), and C(4)F(8) Gases Mixed with Oxygen

In this work, we discuss the effects of component ratios on plasma characteristics, chemistry of active species, and silicon etching kinetics in CF(4) + O(2), CHF(3) + O(2), and C(4)F(8) + O(2) gas mixtures. It was shown that the addition of O(2) changes electrons- and ions-related plasma parameters...

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Detalles Bibliográficos
Autores principales: Baek, Seung Yong, Efremov, Alexander, Bobylev, Alexander, Choi, Gilyoung, Kwon, Kwang-Ho
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383355/
https://www.ncbi.nlm.nih.gov/pubmed/37512317
http://dx.doi.org/10.3390/ma16145043