Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment

A non-thermal atmospheric jet plasma pre-treatment technique was introduced to help the growth of extremely sticky copper films on fused silica glass substrates. A tape test was utilized to assess the bonding quality between copper films and fused silica glass substrates. AFM was used to characteriz...

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Detalles Bibliográficos
Autores principales: Yang, Liqing, Yang, Xianli, Gao, Fei, Guan, Yongmao, Wan, Rui, Wang, Pengfei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383439/
https://www.ncbi.nlm.nih.gov/pubmed/37512426
http://dx.doi.org/10.3390/ma16145152

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383439/
https://www.ncbi.nlm.nih.gov/pubmed/37512426
http://dx.doi.org/10.3390/ma16145152

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