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Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment
A non-thermal atmospheric jet plasma pre-treatment technique was introduced to help the growth of extremely sticky copper films on fused silica glass substrates. A tape test was utilized to assess the bonding quality between copper films and fused silica glass substrates. AFM was used to characteriz...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383439/ https://www.ncbi.nlm.nih.gov/pubmed/37512426 http://dx.doi.org/10.3390/ma16145152 |