Thermal Management of Microelectronic Devices Using Nanofluid with Metal foam Heat Sink

Microelectronic components are used in a variety of applications that range from processing units to smart devices. These components are prone to malfunctions at high temperatures exceeding 373 K in the form of heat dissipation. To resolve this issue, in microelectronic components, a cooling system...

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Detalles Bibliográficos
Autores principales: Tahir, Muhammad Teham, Anwar, Shahzaib, Ahmad, Naseem, Sattar, Mariyam, Qazi, Usama Waleed, Ghafoor, Usman, Bhutta, Muhammad Raheel
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383464/
https://www.ncbi.nlm.nih.gov/pubmed/37512786
http://dx.doi.org/10.3390/mi14071475

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383464/
https://www.ncbi.nlm.nih.gov/pubmed/37512786
http://dx.doi.org/10.3390/mi14071475

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