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Thermal Management of Microelectronic Devices Using Nanofluid with Metal foam Heat Sink
Microelectronic components are used in a variety of applications that range from processing units to smart devices. These components are prone to malfunctions at high temperatures exceeding 373 K in the form of heat dissipation. To resolve this issue, in microelectronic components, a cooling system...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383464/ https://www.ncbi.nlm.nih.gov/pubmed/37512786 http://dx.doi.org/10.3390/mi14071475 |