Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method

In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability of micro bumps, which plays an important role in mechanical support, electrical connection, signal transmission and heat dissipation, determines the quality of c...

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Detalles Bibliográficos
Autores principales: Ji, Haoyue, Tian, Wenchao, Qian, Hongwen, Sun, Xiaodong, Wang, Yongkun, Gu, Lin, Zheng, Lihua
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383873/
https://www.ncbi.nlm.nih.gov/pubmed/37512661
http://dx.doi.org/10.3390/mi14071345

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383873/
https://www.ncbi.nlm.nih.gov/pubmed/37512661
http://dx.doi.org/10.3390/mi14071345

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