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Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method
In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability of micro bumps, which plays an important role in mechanical support, electrical connection, signal transmission and heat dissipation, determines the quality of c...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383873/ https://www.ncbi.nlm.nih.gov/pubmed/37512661 http://dx.doi.org/10.3390/mi14071345 |