Cargando…
Study of Selective Dry Etching Effects of 15-Cycle Si(0.7)Ge(0.3)/Si Multilayer Structure in Gate-All-Around Transistor Process
Gate-all-around (GAA) structures are important for future logic devices and 3D-DRAM. Inner-spacer cavity etching and channel release both require selective etching of Si(0.7)Ge(0.3). Increasing the number of channel-stacking layers is an effective way to improve device current-driving capability and...
Autores principales: | Liu, Enxu, Li, Junjie, Zhou, Na, Chen, Rui, Shao, Hua, Gao, Jianfeng, Zhang, Qingzhu, Kong, Zhenzhen, Lin, Hongxiao, Zhang, Chenchen, Lai, Panpan, Yang, Chaoran, Liu, Yang, Wang, Guilei, Zhao, Chao, Yang, Tao, Yin, Huaxiang, Li, Junfeng, Luo, Jun, Wang, Wenwu |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10384643/ https://www.ncbi.nlm.nih.gov/pubmed/37513138 http://dx.doi.org/10.3390/nano13142127 |
Ejemplares similares
-
Investigate on the Mechanism of HfO(2)/Si(0.7)Ge(0.3) Interface Passivation Based on Low-Temperature Ozone Oxidation and Si-Cap Methods
por: Yao, Qide, et al.
Publicado: (2021) -
Growth and Selective Etch of Phosphorus-Doped Silicon/Silicon–Germanium Multilayers Structures for Vertical Transistors Application
por: Li, Chen, et al.
Publicado: (2020) -
Depth profiles of the interfacial strains of Si(0.7)Ge(0.3)/Si using three-beam Bragg-surface diffraction
por: Zheng, Yan-Zong, et al.
Publicado: (2016) -
C(0.3)N(0.7)Ti-SiC Toughed Silicon Nitride Hybrids with Non-Oxide Additives Ti(3)SiC(2)
por: Luo, Heng, et al.
Publicado: (2020) -
Strained Si(0.2)Ge(0.8)/Ge multilayer Stacks Epitaxially Grown on a Low-/High-Temperature Ge Buffer Layer and Selective Wet-Etching of Germanium
por: Xie, Lu, et al.
Publicado: (2020)