ATNet: A Defect Detection Framework for X-ray Images of DIP Chip Lead Bonding

In order to improve the production quality and qualification rate of chips, X-ray nondestructive imaging technology has been widely used in the detection of chip defects, which represents an important part of the quality inspection of products after packaging. However, the current traditional defect...

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Detalles Bibliográficos
Autores principales: Huang, Renbin, Zhan, Daohua, Yang, Xiuding, Zhou, Bei, Tang, Linjun, Cai, Nian, Wang, Han, Qiu, Baojun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10384794/
https://www.ncbi.nlm.nih.gov/pubmed/37512688
http://dx.doi.org/10.3390/mi14071375

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10384794/
https://www.ncbi.nlm.nih.gov/pubmed/37512688
http://dx.doi.org/10.3390/mi14071375

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