Built-In Packaging for Two-Terminal Devices

Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues. In this study, we propose a built-in packaging method and evaluate its performance compared to probing and w...

Descripción completa

Detalles Bibliográficos
Autores principales: Gulsaran, Ahmet, Bastug Azer, Bersu, Ozyigit, Dogu, Saritas, Resul, Kocer, Samed, Abdel-Rahman, Eihab, Yavuz, Mustafa
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10384851/
https://www.ncbi.nlm.nih.gov/pubmed/37512784
http://dx.doi.org/10.3390/mi14071473

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10384851/
https://www.ncbi.nlm.nih.gov/pubmed/37512784
http://dx.doi.org/10.3390/mi14071473

Ejemplares similares