Silicon Micromachined TSVs for Backside Interconnection of Ultra-Small Pressure Sensors

This paper presents an ultra-small absolute pressure sensor with a silicon-micromachined TSV backside interconnection for high-performance, high spatial resolution contact pressure sensing, including flexible-substrate applications. By exploiting silicon-micromachined TSVs that are compatibly fabric...

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Detalles Bibliográficos
Autores principales: Feng, Weiwen, Li, Peng, Zhang, Haozhi, Sun, Ke, Li, Wei, Wang, Jiachou, Yang, Heng, Li, Xinxin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10384946/
https://www.ncbi.nlm.nih.gov/pubmed/37512758
http://dx.doi.org/10.3390/mi14071448

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10384946/
https://www.ncbi.nlm.nih.gov/pubmed/37512758
http://dx.doi.org/10.3390/mi14071448

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