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The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages
This study suggests promising candidates as highly thermally conductive adhesives for advanced semiconductor packaging processes such as flip chip ball grid array (fcBGA), flip chip chip scale package (fcCSP), and package on package (PoP). To achieve an extremely high thermal conductivity (TC) of th...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10385002/ https://www.ncbi.nlm.nih.gov/pubmed/37514472 http://dx.doi.org/10.3390/polym15143083 |