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The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages

This study suggests promising candidates as highly thermally conductive adhesives for advanced semiconductor packaging processes such as flip chip ball grid array (fcBGA), flip chip chip scale package (fcCSP), and package on package (PoP). To achieve an extremely high thermal conductivity (TC) of th...

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Detalles Bibliográficos
Autores principales:	Choi, Hyun-Seok, Park, Jeong-Hyun, Lee, Jong-Hee
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10385002/ https://www.ncbi.nlm.nih.gov/pubmed/37514472 http://dx.doi.org/10.3390/polym15143083

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