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Investigation of Cutting Force and the Material Removal Mechanism in the Ultrasonic Vibration-Assisted Scratching of 2D-SiCf/SiC Composites

Ultrasonic-assisted grinding (UAG) is widely used in the manufacture of hard and brittle materials. However, the process removal mechanism was never elucidated and its potential is yet to be fully exploited. In this paper, the mechanism of material removal is analyzed by ultrasonic-assisted scratchi...

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Detalles Bibliográficos
Autores principales: Lin, Hao, Zhou, Ming, Wang, Haotao, Bai, Sutong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10385581/
https://www.ncbi.nlm.nih.gov/pubmed/37512659
http://dx.doi.org/10.3390/mi14071350