Investigation of Cutting Force and the Material Removal Mechanism in the Ultrasonic Vibration-Assisted Scratching of 2D-SiCf/SiC Composites

Ultrasonic-assisted grinding (UAG) is widely used in the manufacture of hard and brittle materials. However, the process removal mechanism was never elucidated and its potential is yet to be fully exploited. In this paper, the mechanism of material removal is analyzed by ultrasonic-assisted scratching. Three distinct surfaces (S1, S2, and S3) were selected on the basis of the braided and laminated structure of fiber bundles. The ultrasonic-assisted scratching experiment is carried out under different conditions, and the scratching force (SF) of the tested surface will fluctuate periodically. Under the conditions of different feed speeds, depths, and ultrasonic amplitudes, the normal scratching force (SF(n)) is greater than the tangential scratching force (SF(t)), and the average scratching force on the three surfaces is generally S3 > S2 >S1. Among the three processing parameters, the speed has the most significant influence on the scratching force, while the scratching depth has little influence on the scratching force. Under the same conditions and surface cutting mode, the ultrasonic vibration-assisted scratching force is slightly lower than the conventional scratching force. The scratching force decreases first and then increases with the amplitude of ultrasonic vibration. Because the fiber undergoes a brittle fracture in the ultrasonic-assisted scratching process, the matrix is torn, and the surface residues are discharged in time; therefore, the surface roughness is improved.