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Investigation of Cutting Force and the Material Removal Mechanism in the Ultrasonic Vibration-Assisted Scratching of 2D-SiCf/SiC Composites
Ultrasonic-assisted grinding (UAG) is widely used in the manufacture of hard and brittle materials. However, the process removal mechanism was never elucidated and its potential is yet to be fully exploited. In this paper, the mechanism of material removal is analyzed by ultrasonic-assisted scratchi...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10385581/ https://www.ncbi.nlm.nih.gov/pubmed/37512659 http://dx.doi.org/10.3390/mi14071350 |