Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing

With the continuous reduction in size and increase in density of semiconductor devices, there is a growing demand for contact solutions that enable high-speed testing in automotive, 5G, and artificial intelligence-based devices. Although existing solutions, such as spring pins and rubber sockets, ha...

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Detalles Bibliográficos
Autores principales: Kim, Tae-Kyun, Yook, Jong-Gwan, Kim, Joo-Yong, Cho, Yong-Ho, Lee, Uh-Hyeon
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10386342/
https://www.ncbi.nlm.nih.gov/pubmed/37514644
http://dx.doi.org/10.3390/s23146350

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10386342/
https://www.ncbi.nlm.nih.gov/pubmed/37514644
http://dx.doi.org/10.3390/s23146350

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