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Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing
With the continuous reduction in size and increase in density of semiconductor devices, there is a growing demand for contact solutions that enable high-speed testing in automotive, 5G, and artificial intelligence-based devices. Although existing solutions, such as spring pins and rubber sockets, ha...
Autores principales: | Kim, Tae-Kyun, Yook, Jong-Gwan, Kim, Joo-Yong, Cho, Yong-Ho, Lee, Uh-Hyeon |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10386342/ https://www.ncbi.nlm.nih.gov/pubmed/37514644 http://dx.doi.org/10.3390/s23146350 |
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