Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

Owing to the increasing demand for the miniaturization and integration of electronic devices, thermal interface materials (TIMs) are crucial components for removing heat and improving the lifetime and safety of electronic devices. Among these, thermal pads are reusable alternatives to thermal paste-...

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Detalles Bibliográficos
Autores principales: Song, Kiho, Choi, Junhyeok, Cho, Donghwi, Lee, In-Hwan, Ahn, Changui
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10386388/
https://www.ncbi.nlm.nih.gov/pubmed/37512377
http://dx.doi.org/10.3390/ma16145102

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10386388/
https://www.ncbi.nlm.nih.gov/pubmed/37512377
http://dx.doi.org/10.3390/ma16145102

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