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Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading
Ni-xCu/Sn soldering joints were aged at 200 °C, and the microstructure evolution and mechanical properties during the solid-state reaction were studied under shear loading. Results showed that the intermetallic compounds (IMCs) exhibited a Cu content-dependent transformation from the (Ni,Cu)(3)Sn(4)...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10420103/ https://www.ncbi.nlm.nih.gov/pubmed/37569956 http://dx.doi.org/10.3390/ma16155253 |