Cargando…

Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading

Ni-xCu/Sn soldering joints were aged at 200 °C, and the microstructure evolution and mechanical properties during the solid-state reaction were studied under shear loading. Results showed that the intermetallic compounds (IMCs) exhibited a Cu content-dependent transformation from the (Ni,Cu)(3)Sn(4)...

Descripción completa

Detalles Bibliográficos
Autores principales:	Li, Zhigang, Cheng, Kai, Liu, Jiajun, He, Yigang, Xiao, Yong
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10420103/ https://www.ncbi.nlm.nih.gov/pubmed/37569956 http://dx.doi.org/10.3390/ma16155253

Ejemplares similares

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
por: Wang, Fengjiang, et al.
Publicado: (2017)

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2021)

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling
por: Cui, Jianguo, et al.
Publicado: (2021)

Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints
por: Chen, Dongdong, et al.
Publicado: (2022)

Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate
por: Huang, M. L., et al.
Publicado: (2014)

Decreasing Shear Stresses of the Solder Joints for Mechanical and Thermal Loads by Topological Optimization
por: Awrejcewicz, Jan, et al.
Publicado: (2020)

Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures
por: Chen, Chaoyu, et al.
Publicado: (2022)

Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition
por: Wang, Qingfeng, et al.
Publicado: (2019)

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate
por: Son, Junhyuk, et al.
Publicado: (2021)

Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2023)

The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints
por: Kang, Min-Soo, et al.
Publicado: (2019)

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test
por: Liang, Kun, et al.
Publicado: (2022)

IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints
por: Ren, Ning, et al.
Publicado: (2020)

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder
por: He, Huang, et al.
Publicado: (2022)

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging
por: Xin, Meiling, et al.
Publicado: (2022)

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
por: Ting Tan, Ai, et al.
Publicado: (2015)

Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
por: Jeong, Gyuwon, et al.
Publicado: (2021)

Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging
por: Li, Yulong, et al.
Publicado: (2018)

Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing
por: Fu, Zhiwei, et al.
Publicado: (2023)

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing
por: Ramli, Mohd Izrul Izwan, et al.
Publicado: (2021)

Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders
por: Laurila, Tomi, et al.
Publicado: (2009)

Microstructure Characterization and Interfacial Reactions between Au-Sn Solder and Different Back Metallization Systems of GaAs MMICs
por: Wu, Na, et al.
Publicado: (2020)

Hybrid solder joints: the effect of nanosized ZrO(2) particles on morphology of as-reflowed and thermally aged Sn–3.5Ag solder joints
por: Wodak, Irina, et al.
Publicado: (2023)

The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
por: Sayyadi, Reza, et al.
Publicado: (2019)

Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
por: Chia, Pay Ying, et al.
Publicado: (2016)

Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints
por: Hsu, Po-Ning, et al.
Publicado: (2022)

Imaging the Polymorphic Transformation in a Single Cu(6)Sn(5) Grain in a Solder Joint
por: Somidin, Flora, et al.
Publicado: (2018)

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow
por: Zaimi, Nur Syahirah Mohamad, et al.
Publicado: (2022)

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints
por: Shen, Yu-An, et al.
Publicado: (2022)

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data
por: Mi, Jinhua, et al.
Publicado: (2014)

Characteristics of novel Ti–10Mo-xCu alloy by powder metallurgy for potential biomedical implant applications
por: Xu, Wei, et al.
Publicado: (2020)

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging
por: Zhao, Di, et al.
Publicado: (2020)

Structure and properties of Sn-Cu lead-free solders in electronics packaging
por: Zhao, Meng, et al.
Publicado: (2019)

Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin
por: Zhang, Peng, et al.
Publicado: (2022)

Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength
por: Atieh, Anas M., et al.
Publicado: (2019)

Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint
por: Lee, Sang-Yeob, et al.
Publicado: (2010)

Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints
por: Zhang, Yuanxiang, et al.
Publicado: (2022)

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
por: Leong, Yee Mei, et al.
Publicado: (2016)

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints
por: Zhang, Chao, et al.
Publicado: (2023)

Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
por: Shen, Yu-An, et al.
Publicado: (2019)

Cannot write session to /tmp/vufind_sessions/sess_93afd1ufqkesa64plvrbt7bp62