Thermally Conductive and Electrically Insulating Epoxy Composites Filled with Network-like Alumina In Situ Coated Graphene

With the rapid development of the electronics industry, there is a growing demand for packaging materials that possess both high thermal conductivity (TC) and low electrical conductivity (EC). However, traditional insulating fillers such as boron nitride, aluminum nitride, and alumina (Al(2)O(3)) ha...

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Detalles Bibliográficos
Autores principales: Lv, Ruicong, Guo, Haichang, Kang, Lei, Bashir, Akbar, Ren, Liucheng, Niu, Hongyu, Bai, Shulin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10420872/
https://www.ncbi.nlm.nih.gov/pubmed/37570558
http://dx.doi.org/10.3390/nano13152243

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10420872/
https://www.ncbi.nlm.nih.gov/pubmed/37570558
http://dx.doi.org/10.3390/nano13152243

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