Materials Quest for Advanced Interconnect Metallization in Integrated Circuits

Integrated circuits (ICs) are challenged to deliver historically anticipated performance improvements while increasing the cost and complexity of the technology with each generation. Front‐end‐of‐line (FEOL) processes have provided various solutions to this predicament, whereas the back‐end‐of‐line...

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Detalles Bibliográficos
Autores principales: Moon, Jun Hwan, Jeong, Eunjin, Kim, Seunghyun, Kim, Taesoon, Oh, Eunsoo, Lee, Keun, Han, Hauk, Kim, Young Keun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2023
Materias:
Reviews
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10427378/
https://www.ncbi.nlm.nih.gov/pubmed/37318187
http://dx.doi.org/10.1002/advs.202207321

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10427378/
https://www.ncbi.nlm.nih.gov/pubmed/37318187
http://dx.doi.org/10.1002/advs.202207321

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