Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements

[Image: see text] Semiconductor packaging based on an epoxy molding compound (EMC) currently has several disadvantages including warpage, limited processing area, and variability that all negatively affect cost and production yield. We propose a facile EMC molding process method using a flash electr...

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Detalles Bibliográficos
Autores principales: Park, Seong Yeon, On, Seung Yoon, Kim, Junmo, Lee, Jeonyoon, Kim, Taek-Soo, Wardle, Brian L., Kim, Seong Su
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2023
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10436241/
https://www.ncbi.nlm.nih.gov/pubmed/37535803
http://dx.doi.org/10.1021/acsami.3c06145

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10436241/
https://www.ncbi.nlm.nih.gov/pubmed/37535803
http://dx.doi.org/10.1021/acsami.3c06145

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