Cargando…
Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements
[Image: see text] Semiconductor packaging based on an epoxy molding compound (EMC) currently has several disadvantages including warpage, limited processing area, and variability that all negatively affect cost and production yield. We propose a facile EMC molding process method using a flash electr...
| Autores principales: | , , , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American Chemical Society
2023
|
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10436241/ https://www.ncbi.nlm.nih.gov/pubmed/37535803 http://dx.doi.org/10.1021/acsami.3c06145 |