A low-profile electromechanical packaging system for soft-to-flexible bioelectronic interfaces

Interfacing the human body with the next generation of electronics requires technological advancement in designing and producing bioelectronic circuits. These circuits must integrate electrical functionality while simultaneously addressing limitations in mechanical compliance and dynamics, biocompat...

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Detalles Bibliográficos
Autores principales: Fallegger, Florian, Trouillet, Alix, Coen, Florent-Valéry, Schiavone, Giuseppe, Lacour, Stéphanie P.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: AIP Publishing LLC 2023
Materias:
Articles
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10439817/
https://www.ncbi.nlm.nih.gov/pubmed/37600068
http://dx.doi.org/10.1063/5.0152509

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10439817/
https://www.ncbi.nlm.nih.gov/pubmed/37600068
http://dx.doi.org/10.1063/5.0152509

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