Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams

Silicon-on-insulator (SOI) wafers are crucial raw materials in the manufacturing process of microelectromechanical systems (MEMS). Residual stresses generated inside the wafers during the fabrication process can seriously affect the performance, reliability, and yield of MEMS devices. In this paper,...

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Detalles Bibliográficos
Autores principales: Yang, Haotian, Liu, Min, Zhu, Yingmin, Wang, Weidong, Qin, Xianming, He, Lilong, Jiang, Kyle
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456331/
https://www.ncbi.nlm.nih.gov/pubmed/37630045
http://dx.doi.org/10.3390/mi14081510

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456331/
https://www.ncbi.nlm.nih.gov/pubmed/37630045
http://dx.doi.org/10.3390/mi14081510

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