Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array

In this research, an efficient thermal-stress coupling design method for a Chiplet-based system with a coaxial through silicon via (CTSV) array is developed by combining the support vector machine (SVM) model and particle swarm optimization algorithm with linear decreasing inertia weight (PSO-LDIW)....

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Detalles Bibliográficos
Autores principales: Wang, Xianglong, Su, Jiaming, Chen, Dongdong, Li, Di, Li, Gaoliang, Yang, Yintang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456537/
https://www.ncbi.nlm.nih.gov/pubmed/37630027
http://dx.doi.org/10.3390/mi14081493

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456537/
https://www.ncbi.nlm.nih.gov/pubmed/37630027
http://dx.doi.org/10.3390/mi14081493

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