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Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array
In this research, an efficient thermal-stress coupling design method for a Chiplet-based system with a coaxial through silicon via (CTSV) array is developed by combining the support vector machine (SVM) model and particle swarm optimization algorithm with linear decreasing inertia weight (PSO-LDIW)....
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456537/ https://www.ncbi.nlm.nih.gov/pubmed/37630027 http://dx.doi.org/10.3390/mi14081493 |