Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

With the advancement of semiconductor technology, chip cooling has become a major obstacle to enhancing the capabilities of power electronic systems. Traditional electronic packaging materials are no longer able to meet the heat dissipation requirements of high-performance chips. High thermal conduc...

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Detalles Bibliográficos
Autores principales: Lai, Liyan, Niu, Bing, Bi, Yuxiao, Li, Yigui, Yang, Zhuoqing
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456570/
https://www.ncbi.nlm.nih.gov/pubmed/37630026
http://dx.doi.org/10.3390/mi14081491

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456570/
https://www.ncbi.nlm.nih.gov/pubmed/37630026
http://dx.doi.org/10.3390/mi14081491

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